Terms of Vacuum Coating

Terminology of Vacuum Coating Process

1. Vacuum sputtering: In a vacuum, inert gas ions bombard atoms (molecules) or groups of atoms from the target surface.

1.1 Reactive vacuum sputtering: Vacuum sputtering of film materials with ideal chemical composition through reaction with gas.

1.2 Bias sputtering: During the sputtering process, a bias voltage is applied to the substrate and the sputtering of the film.

1.3 Direct current diode sputtering: Through the direct current voltage between the two electrodes, the gas is self-sustained to discharge and the target is used as the cathode for sputtering.

1.4 Asymmetric alternate current sputtering: Through the asymmetric AC voltage between the two electrodes, the gas is self-sustained to discharge and the target is used as an electrode that absorbs a large positive ion current.

1.5 High frequency diode sputtering: A high-frequency discharge is obtained by the high-frequency voltage between the two electrodes, and the target is sputtered with a negative potential.

1.6 Hot cathode direct current sputtering: The non-self-sustained gas discharge is obtained by means of the hot cathode and the anode, and the ions generated by the gas discharge are accelerated by the voltage applied between the anode and the cathode (target) to bombard the sputtering of the target.

1.7 Hot cathode high frequency sputtering: A non-self-sustained gas discharge is obtained by means of a hot cathode and an anode, and the ions generated by the gas discharge are accelerated under the action of the negative potential on the target surface to bombard the sputtering of the target.

1.8 Ion beam sputtering: Sputtering of the target using the ion beam obtained by a special ion source.

1.9 Glow discharge cleaning: Using the principle of glow discharge, the substrate and the surface of the film are subjected to the cleaning process of gas discharge bombardment.

2. Physical vapor deposition (PVD): In the vacuum state, the coating material is vaporized by physical methods such as evaporation or sputtering, and deposited on the substrate. A method of preparing the film.

3. Chemical vapor deposition (CVD): A method in which a certain chemical ratio of reaction gas, under a specific activation condition (usually a certain high temperature), generates a new film layer material through a gas phase chemical reaction and deposits on the substrate to prepare a film layer.

4. Magnetron sputtering: With the help of the orthogonal electromagnetic field formed on the target surface, the secondary electrons are bound to a specific area on the target surface to enhance ionization efficiency, increase ion density and energy, so that a high sputtering rate can be achieved under low voltage and high current.

5. Plasma chemistry vapor deposition (PCVD): The plasma generated by the discharge promotes the chemical reaction in the gas phase, and a method of making a film on the substrate at a low temperature.

6. Hollow cathode discharge deposition (HCD): A large number of electron beams are emitted with a hollow cathode to evaporate and ionize the coating material in the crucible. Under the action of the negative bias on the substrate, the ions have greater energy and are deposited on the surface of the substrate.

7. Arc discharge deposition: A vacuum coating method in which the coating material is used as the target and arc discharge is generated on the surface of the target by means of a trigger device. Under the action of the arc, the coating material is evaporated without a molten pool and deposited on the substrate.

Terminology for vacuum coating special parts

1. Coating chamber: Parts that implement the actual coating process in the vacuum coating equipment.

2. Evaporator device: The vacuum coating equipment includes the evaporator and all the devices needed for its work (such as power supply, material supply and cooling devices, etc.)

3. Evaporator: Evaporation A device in which the evaporation is directly carried out, such as a small boat-shaped evaporator, crucible, filament, heating plate, heating rod, spiral coil, etc., if necessary, also includes the evaporation material itself.

4. Evaporator by direct heat: An evaporator in which the evaporating material itself is heated.

5. Evaporator by indirect heat: An evaporator in which the evaporating material is heated by heat conduction or heat radiation.

6. Evaporation field: A field formed by several evaporators arranged to heat the same evaporating material.

7. Sputtering device: Components of vacuum sputtering equipment including targets and auxiliary devices necessary for sputtering (such as power supply devices, gas introduction devices, etc.).

8. Target: Surface bombarded with particles. The meaning of the target in this standard is the electrode composed of sputtering material in the sputtering device.

9. Shutter: A device used to limit the coating in time and/or space and thereby achieve a certain film thickness distribution. The baffle can be fixed or movable.

10. Timing shutter: It can be used to limit the coating in time, so the device can be carried out at the specified time from the beginning, interruption to the end of the coating.

11. Mask：A device used to cover part of the substrate and limit the coating in space.

12. Substrate holder: Devices that can directly clamp substrates, such as clamping devices, frames and similar clamping devices.

13. Clamp: A device that supports a substrate or several substrates with or without a substrate holder in the coating equipment, such as a chuck, a clamping drum, a spherical clamping cover, a clamping basket, etc. The clamping device can be fixed or movable (rotating frame, planetary gear train, etc.).

14. Reversing device: In the vacuum coating equipment, the device that can put the substrate, test glass or mask in the ideal position without opening the equipment (substrate commutator, test glass commutator, mask commutator.)

15. Substrate heating device: In vacuum coating equipment, a device that can make a substrate or several substrates reach the desired temperature by heating.

16. Substrate colding device: In vacuum coating equipment, a device that can make a substrate or several substrates reach the desired temperature by cooling.